[time-nuts] Wenzel Oscillator Repair

Magnus Danielson magnus at rubidium.dyndns.org
Wed Jan 21 21:12:03 UTC 2009


Joe,

>> The pre-heating trick actually makes the big soldering iron rest most of 
> 
>> the time...
>>
>> We have boards with so much ground/power grids that it is really a 
>> headache to do without pre-heating, which is similar to the iron case 
>> soldering problem.
>>
>> So, doing it this way makes it go fast.
> 
> I think we are talking about different things.  For getting chips off a 
> big multilayer board, preheat plus hot air is a standard way to go, but we 
> are talking about how to unsolder a steel can with foam insulation within. 
>  Slow heating to near soldering temperature is likely to yield a heap of 
> goo. 

Actually no, the physics behind it does not really change and he also 
did unsolder the endcap of a steel can for me in this fashion. No goo 
inside as a result. Worked very well. I expect to be able to use it once 
I am done inside.

> The point of the torch method is to heat the can's solder seam up *fast*, 
> so the solder melts before the foam.

Sure. But pre-heating and hot-air works too.

Cheers,
Magnus



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