[time-nuts] I love the smell of tantalum in the morning
zl3ag at radioengineering.com
Sat Nov 5 22:05:00 EDT 2016
Yes. Unless you're grinding it away with a dremel (which I wouldn't recommend as far as chemical dust is concerned), nibbling away with sidecutters would be trying to force the 2 ends of the component apart. That may be stressing the pads they're soldered to, leading to a possible pad lifting at some stage.
Any of the methods mentioned that heat both ends at the same time - allowing the component to be wiped off the board - would have to be the best, stress-wise.
On 6/11/2016, at 3:00 PM, Scott Stobbe wrote:
> For through hole parts sure, but I would not recommend that on SMD parts,
> the copper foil of a little pad is pretty easy to tear off and it's a royal
> pain if you have to mount a device missing some of its landing pads.
> On Sat, Nov 5, 2016 at 4:37 PM, Tom Miller <tmiller11147 at verizon.net> wrote:
>> I usually nibble away at the center of the part until it is two separate
>> pieces. Then unsolder each piece. Clean the pads off with wick then install
>> the new part.
>> Use a good sharp pair of flush cut side cutters.
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