[time-nuts] LPRO Heat Sink?

steve gunsel sgunsel at verizon.net
Wed Sep 23 16:39:18 UTC 2009


Thanks. That clears things up!

At 12:23 PM 9/23/2009, you wrote:
>The Rb physics package and associated ovens in the LPRO are 
>thermally isolated from the baseplate.  The only heat sources 
>attached to the baseplate are a couple of  TO-220 devices.  So the 
>baseplate is acting as an ordinary heatsink for them.
>The 70C maximum rating for the baseplate is likely based on typical 
>heat losses from the other parts of the device.  If the baseplate 
>(which is easy to measure) is kept below 70C, the rest of the device 
>(which is inaccessible) should be okay.
>steve gunsel wrote:
>>I'm new to this, but it sounded more like this is to be a thermal 
>>mass to minimize temperature swings.
>>Why would you want to efficiently cool something that you are 
>>trying to heat and maintain at a constant temperature?
>>just curious in Medina, OH
>>At 11:12 AM 9/23/2009, you wrote:
>>>At 10:51 AM 9/23/2009, J. Forster wrote...
>>>>Monsterously thick will NOT do it. All that does is increase the heat
>>>>capacity of the HS, not it's ultimate thermal resistance (W/deg).
>>>>You need surface area...
>>>You need both. A 10 m x 10 m piece of aluminum foil won't do much, 
>>>either, despite having a very large surface area.
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